August 5, 2013 - Meyer Burger Technology announces the signing of an important contract with a solar wafer manufacturer in Asia for the delivery of water-based diamond wire saws. The manufacturing equipment is scheduled to be delivered by the end of September 2013.
Meyer Burger has also concluded a contract with a module manufacturer in Asia for the delivery of module equipment. The module technologies include lamination, cell connection, handling and performance testing equipment as well as customer training and support services. Production on customer site is scheduled to begin at the end of August 2013.
It is the first major contractual volume the company has signed since the crisis in the solar market began in the second half of 2011 and it represents a success for diamond wire technology. The company expects an increase in orders for production equipment during the second half of 2013.
Key figures for the first half year results 2013
During the first half year 2013, the situation in the solar industry market remained difficult and as expected the results for the Meyer Burger Group in this reporting period were impacted by low customer demand for production systems and equipment. According to preliminary results, net sales in the first half year 2013 were about CHF 90.4 million. At EBITDA level the company recorded a loss of CHF 58.6 million; at EBIT level a loss of 98.8 million. At net result level, Meyer Burger recorded a loss of CHF 81.9 million. During the first half year 2013, the optimisation and consolidation programmes have been fully implemented as planned. In comparison to the previous reporting period, operating expenses were reduced by CHF 54.7 million (personnel expenses by CHF 30.1 million, other operating expenses by CHF 24.6 million).